- 07770009057
07770009057
تضم هذه الفئة مجموعة مختارة من المعجون الحراري (Thermal Paste) والوسائد الحرارية (Thermal Pads) المصممة لتحسين نقل الحرارة بين المعالج أو كرت الشاشة والمشتت الحراري، مما يساهم في خفض درجات الحرارة وتحقيق أداء مستقر وطويل الأمد.
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سواء كنت تقوم بالتجميع، الصيانة، أو الترقية، ستجد هنا الحل المثالي للحفاظ على أفضل درجات حرارة وأعلى أداء لجهازك.
Category Specification Brand Thermal Grizzly Product Name Kryonaut Thermal Paste Model / Part No. TG-K-100-R Type Premium Performance Thermal Compound Net Weight 37 grams Thermal Conductivity ~12.5 W/m·K Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use CPUs, GPUs, heatsinks on high-performance systems Curing / Burn-in Not required Longevity Long-lasting under heavy loads Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Extreme Thermal Paste Model / Part No. TG-KE-002-R Type Premium Extreme Thermal Compound Net Weight 2 g Thermal Conductivity ~14.2 W/m·K (very high) Thermal Resistance Ultra-low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high Color Dark gray Electrical Conductivity Non-conductive (safe for electronics) Recommended Use High-end CPUs, GPUs, overclocked systems Curing / Burn-in Not required Longevity Long-lasting under sustained load Application Style Syringe with precision tip
Category Specification Brand Thermal Grizzly Product Name Kryonaut Model / Part No. TG-K-001-RS Type Premium Thermal Paste Net Weight 1 gram Thermal Conductivity ~12.5 W/m·K Thermal Resistance Very low Operating Temp Range –250 °C to +350 °C Viscosity Medium-high (easy application) Color Gray Electrical Conductivity Non-conductive Recommended Use CPUs, GPUs, high-performance cooling Curing / Burn-in Not required Longevity Long-lasting under heavy loads Included Syringe with paste
Category Specification Brand Thermal Grizzly Model Carbonaut Part Number TG-CA-32-32-02-R Type Thermal Pad Material High-performance carbon-based thermal pad Thickness 0.5 mm (typical standard) Thermal Conductivity ~17 W/m·K (very high for a pad) Operating Temperature –40 °C to +220 °C Hardness Medium-firm Electrical Conductivity Insulating (non-conductive) Reusability Yes (pads can be re-applied if cleaned) Ideal Use VRAM/VRM cooling, heat sink bridging, component thermal bridging Included Quantity 1 sheet / multiple pieces (varies by packaging) Form Factor Sheet / cuttable pad Compatibility GPUs, CPUs (secondary cooling), PSUs, power components
The Thermal Grizzly Minus Pad 8 (TG-MP8-120-20-15-1R) is a high-performance, 120 x 20 x 1.5 mm pink thermal pad featuring 8.0 W/mK conductivity. It is highly elastic, electrically insulating, and designed for efficient heat transfer in applications like GPU VRMs, memory, and M.2 SSDs.
The Thermal Grizzly Minus Pad 8 (TG-MP8-30-30-05-1R) is a high-performance 30x30x0.5 mm thermal pad with an 8.0 W/mK conductivity rating. It is highly elastic, electrically insulating, and operates between -100°C and +250°C, making it ideal for compensating component gaps in electronics
Specification Details Net Weight 4 g Thermal Conductivity Higher than MX-4, optimized for modern CPUs and GPUs Thermal Resistance Extremely low, designed for efficient heat transfer Viscosity Around 45,000 poise Density 2.6 g/cm³ Operating Temperature Range −50 °C to +150 °C Volume Resistivity 1.8 × 10¹² Ω·cm Breakdown Voltage 7.5 kV/mm Color / Type Grey, high-viscosity non-curing paste Electrical Conductivity Non-conductive and non-capacitive Compatibility Works with CPUs, GPUs, and console chips Application Small central dot or thin even layer recommended Durability Long-lasting, prevents dry-out and pump-out effect
Specification Details Net Weight 2 g Thermal Conductivity 12.8 W/m·K Thermal Impedance < 0.01 °C·cm²/W Specific Gravity (25 °C) 2.8 g/cm³ Operating Temperature Range −150 °C to +250 °C Color / Type Grey non-curing compound Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU applications Application Thin, even layer for optimal thermal contact Use Case High-performance, overclocked, and gaming systems
Specification Details Net Weight 5 g Thermal Conductivity 6.5 W/m·K Thermal Impedance 0.08 °C·cm²/W Specific Gravity (25 °C) 2.9 g/cm³ Operating Temperature Range −50 °C to +200 °C Color / Type Blue-grey non-curing paste Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU thermal interfaces Application Apply a thin, even layer for optimal contact Use Case High-performance builds, overclocking, quiet cooling setups
Specification Details Net Weight 2 g Thermal Conductivity Approximately 4.5 – 5.5 W/m·K Operating Temperature Range −50 °C to +240 °C Color / Type Grey paste (non-curing compound) Electrical Conductivity Non-conductive, safe for CPUs and GPUs Compatibility Suitable for CPU and GPU heatsinks Application Standard “pea” or thin-spread method recommended Durability Long-lasting formula resistant to drying or cracking Viscosity Balanced for smooth application and stable spread Storage Life Up to 3 years (sealed)
